Kyung-Wook Kim: search on Z-Library

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1

Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

Kiwon Lee, Hyoung-Joon Kim, Myung-Jin Yim, Kyung-Wook Paik

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2009

Language:

english

File:

PDF, 2.12 MB

english, 2009

2

Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

Hyoung-Joon Kim, Kyung-Wook Paik

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 991 KB

english, 2008

3

Factors associated with stigma and depressive symptoms in family members of patients with epilepsy

Lee, Sang-Ahm, Han, Su-Hyun, Cho, Yang-Je, Kim, Keun Tae, Kim, Ji-Eun, Shin, Dong Jin, Seo, Jong-Geun, Kim, Young-Soo, Ryu, Han Uk, Lee, Seo-Young, Kim, Jung Bin, Kang, Kyung-Wook, Kim, Shinhye, Kwon,

Journal:

Epilepsy & Behavior

Year:

2020

File:

PDF, 318 KB

2020

4

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Kwon, Woon-Seong, Kim, Hyoung-Joon, Paik, Kyung-Wook, Jang, Se-Young, Hong, Soon-Min

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 405 KB

english, 2004

5

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A novel double layer NCF for highly reliable micro-bump interconnection

Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 2.12 MB

english, 2014

6

Integrated daylighting simulation into the architectural design process for museums

Chang-Sung Kim, Kyung-Wook Seo

Journal:

Building Simulation

Year:

2012

Language:

english

File:

PDF, 2.09 MB

english, 2012

7

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)

Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Joong Do Kim, Jin-Woo Lee, Kyung-Wook Paik

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 2.54 MB

english, 2012

8

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

Kim, Hyoung-Joon, Paik, Kyung-Wook

Year:

2007

Language:

english

File:

PDF, 5.90 MB

english, 2007

9

Is Corticospinal Tract Degeneration Caused by Sjögren Syndrome?

Nam, Tai-Seung, Levy, Michael, Kim, Sang-Hoon, Kang, Kyung-Wook, Kim, Byoung Joon, Lee, Seung-Han

Journal:

Journal of Clinical Neurology

Year:

2018

Language:

english

File:

PDF, 788 KB

english, 2018

10

Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

Baik-Woo Lee, Woosoon Jang, Dong-Won Kim, Jeung-hyun Jeong, Jae-Woong Nah, Kyung-Wook Paik, Dongil Kwon

Journal:

Materials Science and Engineering: A

Year:

2004

Language:

english

File:

PDF, 355 KB

english, 2004

11

Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)

Kyoung-Lim Suk, Kyosung Choo, Sung Jin Kim, Jong-Soo Kim, Kyung-Wook Paik

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.48 MB

english, 2012

12

Effects of ACF Bonding Parameters on ACF Joint Characteristics for High-Speed Bonding Using Ultrasonic Bonding Method

Kim, Yoo-Sun, Lee, Kiwon, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1003 KB

english, 2013

13

Effect of Flux Activators on the Solder Wettability of Solder Anisotropic Conductive Films

Seung-Ho Kim,, Yongwon Choi,, Yoo-Sun Kim,, Kyung-Wook Paik,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 1.71 MB

english, 2015

14

Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

Hyoung-Joon Kim,, Joo Yeon Lee,, Kyung-Wook Paik,, Kwang-Won Koh,, Jinhee Won,, Sihyun Choe,, Jin Lee,, Jung-Tak Moon,, Yong-Jin Park,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 929 KB

english, 2003

15

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Thermal stability at the anisotropic conductive films (ACFs)/ organic solderability preservatives (OSPs) Interface

Il Kim,, Hyoung-Joon Kim,, Kyung-Wook Paik,

Year:

2007

Language:

english

File:

PDF, 8.12 MB

english, 2007

16

The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound

Soon-Jin Cho,, Kyung-Wook Paik,, Young-Gil Kim,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1997

Language:

english

File:

PDF, 182 KB

english, 1997

17

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Effects of thermo-compression bonding parameters on joint formation of micro-bumps in non-conductive film (NCF)

Shin, Ji-Won, Kim, Young Soon, Lee, Hyoung Gi, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

Year:

2015

Language:

english

File:

PDF, 1.18 MB

english, 2015

18

Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low-tolerance embedded capacitors fabrication in organic substrates

Sung-Dong Cho, Jang, K.-W., Jin-Gul Hyun, Sangyong Lee, Kyung-Wook Paik, Hyungsoo Kim, Joung-Ho Kim

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2005

Language:

english

File:

PDF, 1.57 MB

english, 2005

19

Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability

Sang-Ah Gam, Hyoung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Jeong-Tak Moon, Kyung-Wook Paik

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 571 KB

english, 2006

20

Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly

Won-Chul Kim, Kiwon Lee, Saarinen, I.J., Pykari, L., Kyung-Wook Paik

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 883 KB

english, 2012

21

A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films

Pan, Yan, Oh, Seung-Jin, Kim, Ji-Hye, Kim, Taek-Soo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 3.35 MB

2020

22

Effects of Thermal Cycling on Material Properties of Nonconductive Pastes (NCPs) and the Relationship Between Material Properties and Warpage Behavior During Thermal Cycling

Kyung-Woon Jang,, Hyoung-Joon Kim,, Chang-Kyu Chung,, Kyung-Wook Paik,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2008

Language:

english

File:

PDF, 3.22 MB

english, 2008

23

Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections

Il Kim, Kyung-Woon Jang, Ho-Young Son, Jae-Han Kim, Kyung-Wook Paik

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 651 KB

english, 2011

24

Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high Tg ACFs in fine-pitch chip-on-glass applications

Chang-Kyu Chung, Jae-Han Kim, Jong-Won Lee, Kyoung-Won Seo, Kyung-Wook Paik

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.90 MB

english, 2012

25

Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die

Seon Young Yu, Yong-Min Kwon, Jinsu Kim, Taesung Jeong, Seogmoon Choi, Kyung-Wook Paik

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.48 MB

english, 2012

26

A Study on the Flexible Chip On Fabric (COFa) Assemblies using Anisotropic Conductive Films (ACFs) and Metal-Laminated Fabric Substrates

Jung, Seung-Yoon, Lee, Tae-Ik, Cho, Minsun, Kim, Taek-Soo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

Language:

english

File:

PDF, 3.49 MB

english, 2020

27

Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Kim, Tae-Wan, Lee, Tae-Ik, Pan, Yan, Kim, Wansun, Zhang, Shuye, Kim, Taek-Soo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 6.58 MB

english, 2016

28

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Ultrasonic-assisted thermo-compression bonding method for high-performance solder anisotropic conductive film (ACF) joints

Kim, Yoo-Sun, Lee, Kiwon, Paik, Kyung-Wook

Year:

2012

Language:

english

File:

PDF, 1.69 MB

english, 2012

29

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Study on the thermal cycle and drop test reliability of system-in-packages with an Embedded die

Yu, Seon Young, Kwon, Yong-Min, Kim, Jinsu, Jeong, Taesung, Choi, Seogmoon, Paik, Kyung-Wook

Year:

2011

Language:

english

File:

PDF, 4.48 MB

english, 2011

30

A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding

Shuye Zhang,, Seung-Ho Kim,, Tae-Wan Kim,, Yoo-Sun Kim,, Kyung-Wook Paik,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 2.94 MB

english, 2015

31

Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji-Hye, Lee, Tae-Ik, Shin, Ji-Won, Kim, Taek-Soo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 2.65 MB

english, 2016

32

-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method

Park, Jae-Hyeong, Kim, Tae-Wan, Zhang, Shuye, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 4.31 MB

english, 2016

33

Analysis of discrepant results between the Genotype® MTBDRplus assay and an antimicrobial drug susceptibility test for isoniazid-resistant tuberculosis

Jo, Kyung-Wook, Yeo, Yoomi, Sung, Heungsup, Kim, Mi-Na, Shim, Tae Sun

Journal:

Respiratory Medicine

Year:

2017

Language:

english

File:

PDF, 289 KB

english, 2017

34

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Bending Properties of Fine Pitch Flexible CIF (Chip-in-Flex) Packages Using APL (Anchoring Polymer Later) ACFs (Anisotropic Conductive Films)

Kim, Ji-Hye, Yoon, Dal-Jin, Paik, Kyung-Wook

Year:

2019

Language:

english

File:

PDF, 1.13 MB

english, 2019

35

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A novel fine pitch TSV interconnection method using NCF with Zn nano-particles

Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 2.65 MB

english, 2014

36

Effect of Mo substitution by W on high temperature embrittlement characteristics in duplex stainless steels

Sang-Beom Kim, Kyung-Wook Paik, Young-Gil Kim

Journal:

Materials Science and Engineering: A

Year:

1998

Language:

english

File:

PDF, 593 KB

english, 1998

37

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - High temperature reliability of Pd-alloyed Au wire/Al bonding interface

Kim, Hyoung Joon, Song, Min Suk, Lee, Jae Hak, Song, Jun Yeob, Paik, Kyung-Wook

Year:

2012

File:

PDF, 3.47 MB

2012

38

Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn–Ag Microbump

Kim, Youngsoon, Yoon, Taeshik, Kim, Tae-Wan, Kim, Taek-Soo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 3.78 MB

english, 2017

39

A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films

Jung, Seung-Yoon, Oh, Seung Jin, Lee, Tae-Ik, Kim, Taek-Soo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 1.55 MB

2020

40

The weight-bearing scanogram technique provides better coronal limb alignment than the navigation technique in open high tibial osteotomy

Lee, Dae-Hee, Han, Seoung-Bum, Oh, Kwang-Jun, Lee, Jun Seop, Kwon, Jae-Ho, Kim, Jong-In, Patnaik, Smarajit, Shetty, Gautam M., Nha, Kyung-Wook

Journal:

Year:

2014

Language:

english

File:

PDF, 370 KB

english, 2014

41

Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package

Kim, Young-Lyong, Lee, Tae-Ik, Kim, Ji-Hye, Kim, Wonsik, Kim, Taek-Soo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 3.34 MB

english, 2016

42

Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, SeYong, Lee, HanMin, Shin, Ji-Won, Kim, Woojeong, Choi, Taejin, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 2.82 MB

english, 2017

43

Low-Temperature Curable Photo-Active Anisotropic Conductive Films (PA-ACFs)

Kim, Il, Paik, Kyung-Wook

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 2.30 MB

english, 2014

44

Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films

Choi, Yongwon, Shin, Jiwon, Suk, Kyung-lim, Kim, Young Soon, Kim, Il, Paik, Kyung-Wook

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 1.69 MB

english, 2014

45

A Study on Dielectric Constants of ${\rm Epoxy/SrTiO}_{3}$ Composite for Embedded Capacitor Films (ECFs)

Lee, Sangyong, Hyun, Jin-Gul, Kim, Hyungsoo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 2.07 MB

english, 2007

46

Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40μm pitch Cu-pillar/Sn–Ag bump interconnection

Shin, Ji-Won, Kim, Il, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Jee, Young Kun, Paik, Kyung-Wook

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 3.42 MB

english, 2015

47

Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Kim, Youngsoon, Lee, Seyong, Shin, Ji-won, Paik, Kyung-Wook

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 2.35 MB

english, 2016

48

SAE Technical Paper Series [SAE International Powertrain & Fluid Systems Conference and Exhibition - (OCT. 29, 2007)] SAE Technical Paper Series - Investigation of Emission Reduction Effect by Controlling Cooling System in a Diesel Engine

Choi, Kyung-wook, Kim, Hyung-min, Cho, Won-joon, Lee, Ki-hyung

Year:

2007

Language:

english

File:

PDF, 668 KB

english, 2007

49

High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Woonghwan Ryu,, Myung-Jin Yim,, Seungyoung Ahn,, Junho Lee,, Woopoung Kim,, Kyung-Wook Paik,, Joungho Kim,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2000

Language:

english

File:

PDF, 169 KB

english, 2000

50

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - A Study on the Curing Properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly

Lee, HanMin, Lee, SeYong, Park, JongHo, Chung, Chang-kyu, Jang, Kyung-Woon, Kim, Il, Choi, SeongWoo, Paik, Kyung-Wook

Year:

2018

Language:

english

File:

PDF, 623 KB

english, 2018

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